Micromachined silicon probe card for semiconductor dice and method of fabrication

摘要

A probe card for testing semiconductor dice contained on a wafer and a method for fabricating the probe card are provided. The probe card includes a substrate preferably formed of silicon, and having a pattern of contact members corresponding to a pattern of test pads on the wafer. Each contact member is formed integrally with the substrate and includes a projection formed as an elongated blade adapted to penetrate into a corresponding test pad to a limited penetration depth. In addition, a cavity and a flexible membrane are formed in the substrate subjacent to the contact members to permit flexure of the contact members. Fluid or gas pressure can be introduced into the cavity through flow passages formed in the substrate.