| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is effective in a thickness reduction of a package. SOLUTION: An opening 10 is provided at the center of a TAB tape 36, a static RAM 34 is arranged in the opening 10, and a flash memory 32 is placed on the top surface of the TAB tape 36. The static RAM 34 is connected to the flash memory 32 through the intermediary of electrode pads 22, and the flash memory 32 is connected to the wiring pattern 18 of the TAB tape 36 through the intermediary of the electrode pads 22. A heat sink 24 is arranged on the top surface of the flash memory 32, and the static RAM 34 is sealed up with sealing resin 26.
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