| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer inspection device capable of inspecting the surface and the back of a wafer without depending on handling operation using a vacuum tweezers or the like. SOLUTION: This semiconductor wafer inspection device consists of a base 1, a rotating stage 2 which can rotate around a shaft center V perpendicular to the upper surface of the base, and a wafer retaining frame 4 installed on a strut 3 which is collectively formed integrally with the rotating stage 2. The wafer retaining frame 4 has a U-shape and is provided with fixing means 5a, 5b, 5c, 6a, 6b, 6c which fix and hold edge parts of a wafer 8, on the upper surfaces of the respective three edges of the U-shape. The surface and the back of the wafer retaining frame 4 can be reversed to the rotating stage 2 by rotating around a shaft center H parallel to the upper surface of the base.
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