| 摘要 |
PROBLEM TO BE SOLVED: To efficiently generate a thin and uniform surface light emission by mounting an LED chip that can apply light in all directions on an upper surface onto a printed-wiring board, mixing powder with diffusion effect or reflection effect with resin, and performing resin molding to an entire LED chip-packaging surface. SOLUTION: Straight light being emitted on an entire surface from each point of an LED chip 1 is diffused and irregularly reflected in a mold due to powder with diffusion effect or reflection effect being mixed into a resin mold 4 for enabling the entire mold to emit light. Also, light emitted from an area other than a lighting surface is applied to the inside of the mold again by reflection machining on the inner surface of a packaging surface/case 5 of the LED chip 1 to compensate for the attenuation of the quantity of light from an end part. The LED chip 1 is directly mounted onto a printed wiring board 2 for achieving cooling effect, and further cooling machining is executed to the printed-wiring board 2 and the case 5, thus improving emission efficiency per power. |
