发明名称 |
Terminal arrangement for an SMD-capable hybrid circuit |
摘要 |
Terminal pins with two lateral portions and a bridge-shaped elevated middle portion are provided. The terminal pin and perpendicularly rising hybrid circuit typically together have an inverted T shape. On the one hand, the hybrid circuit stands on its own on the substrate without further means of assistance and can be soldered. On the other hand, the bridge-shaped construction effects a sufficient elasticity and carrying capacity relative to swivellings, or respectively, accelerations, as well as effecting the presence of two defined support surfaces whose co-planarity is guaranteed by the springing configuration of the terminal pins.
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申请公布号 |
US6072235(A) |
申请公布日期 |
2000.06.06 |
申请号 |
US19980065822 |
申请日期 |
1998.04.23 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
REHNELT, KARL;TEMPLIN, FRANK |
分类号 |
H01L23/498;H05K3/30;H05K3/36;(IPC1-7):H01L23/02;H01L23/495 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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