发明名称 FORMING METHOD OF ELECTRIC WIRING AND ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a forming method of electric wiring which can form a predetermined electric wiring accurately on the side surface of base material having a solid form or on base material having irregularities. SOLUTION: This method contains a first process wherein a first thin film layer 400 and a second thin film layer 401 which turn to electric conduction parts are formed on base material, and sequentially a metal thin film capable of anodic oxidation, as a third thin film layer 310, is formed on the second thin film layer 401, a second process wherein a notch 351 is formed in a thin film layer 300 composed of the three layers 400, 401, 310, and the thin film is divided into a part 330 to be turned into electric wiring and a part 331 to be eliminated, a third process wherein a barrier type anodic oxidation layer 301 is formed by anodizing the surface of the part 331 to be eliminated, and a process which selectively eliminates the part 331 to be eliminated. The above processes are performed in this order and wiring 201 is formed.
申请公布号 JP2000156553(A) 申请公布日期 2000.06.06
申请号 JP19980331034 申请日期 1998.11.20
申请人 SEIKO EPSON CORP 发明人 IWAMOTO OSAMU;UMETSU KAZUNARI
分类号 H05K1/18;B81C1/00;C25D11/04;G01C19/56;H01L21/3205;H03H3/02 主分类号 H05K1/18
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