发明名称 ARRAY TYPE MULTI CHIP PARTS
摘要 PURPOSE: An array type multi chip parts is provided to coat glass material on the portion of surface in which outer terminals are formed except protruded inner electrodes, and then be plasticized. CONSTITUTION: In an array type multi chip parts integrating at least two elements into single combined element, the multi chip parts is characterized in that at least two element of homogeneous or heterogeneous are arranged in array format and plural inner electrodes(2) are protruded from both sides opposing each other to be plasticized as a stack plastic body(1). Plural glass pastes(3) containing PbO 15-30wt%, ZnO 5-15wt%, Al2O3 10-25wt%, B2O3 15-30wt%, SiO2 10-25wt% are coated in predetermined width between the inner electrodes(2).
申请公布号 KR20000031022(A) 申请公布日期 2000.06.05
申请号 KR19980046807 申请日期 1998.11.02
申请人 SERATECH CORPORATION. 发明人 AHN, BYUNG JUN
分类号 H01G4/12;H01C7/10;H01C13/02;H01G4/232;H01G4/30;H01G4/40;H01G9/042;H01L23/12;(IPC1-7):H01G9/042 主分类号 H01G4/12
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