| 摘要 |
A surface grinding method is provided by which grinding striations are produced so that the striations can fully be removed by a polish-off amount less than required in a conventional way in mirror polishing following surface grinding using an infeed type surface grinder (12), in which two circular tables (14,16), opposite to each other, which are driven and rotate independently from each other, are arranged so that the peripheral end portion (18) of one table (14) coincides with an axial center (20a) of a rotary shaft (20) of the other table (16) all time, the two circular tables (14,16) being located so as to be shifted sideways from each other; not only is a grinding stone (22) held fixedly on an opposite surface of the one table (14), but the wafer (W) is fixed on an opposite surface of the other table (16); the two tables (14,16) are rotated relatively to each other; and at least one table is pressed on the other while at least one table is relatively moved in a direction, so that a surface of the wafer (W) is ground, wherein the surface of the wafer (W) is ground while controlling a pitch of grinding striations produced across all the surface of the wafer (W) processed by the grinding stone (22) to be 1.6 mm or less. <IMAGE>
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