Three-dimensional integrated coil structure for plastics circuit boards

摘要

A coil structure, in which a conically shaped depression or recess (2) is generated in a laminated-type carrier (1) made of a plastics material, from the surface of the carrier down into the depth of the carrier material. Conductive material is then applied to the inner face of the conical recess (2) and is structured so that a spiralling conductor (3) extends up from the floor of the recess to the mouth of the cone-shaped recess. The carrier (1) with the conical recess (2) is specifically a three-dimensional circuit board in moulded interconnect device (MID) technology , with the conductive coating structured by means of a point light source.