| 摘要 |
PROBLEM TO BE SOLVED: To obtain a method for mounting electric elements with which processes can be saved by also mounting backside-surface mount components with pins in a reflow process. SOLUTION: In a method for mounting electric elements in which backside- surface mount components 5 with pins 5a are inserted into the through holes 2 formed on a printed board 1 from its non-mounting surface 1b side to solder on its mounting surface 1a, pads 6 on which cream solder 7 is applied are arranged surrounding the through holes 2 on the mounting surface 1a side of the printed board 1, and after the pins 5a of the backside-surface mount components 5 are inserted from the non-mounting surface 1a side of the printed board 1, the pins 5a are soldered by malting the cream solder in a reflow furnace to mount the backside-surface mount components 5 on the printed board 1. The cream solder 7 heated and melted in the reflow furnace adheres to the pins 5a of the backside-surface mount components to complete soldering.
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