发明名称 Thermal processor for semiconductor wafers
摘要 A thermal processor for at least one semiconductor wafer includes a reactor chamber having a material substantially transparent to light including a wavelength within the range of about 200 nanometers to about 800 nanometers for holding the at least one semiconductor wafer. A coating including a material substantially reflective of infrared radiation can be present on at least a portion of the reactor chamber. A light source provides radiant energy to the at least one semiconductor wafer through the coating and the reactor chamber. The light source can include an ultraviolet discharge lamp, a halogen infrared incandescent lamp, or a metal halide visible discharge lamp. The coating can be situated on an inner or outer surface of the reactor chamber. If the reactor chamber has inner and outer walls, the coating can be situated on either the inner wall or the outer wall.
申请公布号 US6067931(A) 申请公布日期 2000.05.30
申请号 US19960743587 申请日期 1996.11.04
申请人 GENERAL ELECTRIC COMPANY 发明人 GHEZZO, MARIO;PAGE, TIMOTHY DIETRICH;GORCZYCA, THOMAS BERT;BERGMAN, ROLF SVERRE;VAKIL, HIMANSHU BACHUBHAI;HUEY, CHARLES SAMUEL;SILVERSTEIN, SETH DAVID
分类号 H01L21/22;H01L21/00;H01L21/26;H01L21/324;(IPC1-7):C23C16/00;F27D1/00 主分类号 H01L21/22
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