| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize and thin a device, to improve heat dissipation property and to simplify a manufacture process. SOLUTION: The device has a semiconductor element 11, a die pad member 5 holding the semiconductor element 11, plural lead members 3 which are detached from the semiconductor element 11 and are installed on the same plane as the die pad member 5, metallic thin wires 6 which electrically connect the semiconductor element 11 and the lead members 3, and a package main body 2 formed of sealing resin R sealing and fixing the semiconductor element 11 containing the metallic thin wires 6, the die pad member 5 and the lead members 3 from a surface side. The back of the die pad member 5 and the lead members 3 are exposed from the package main body 2. |
