发明名称 Platible non-metallic filler material for metallurgical screening paste
摘要 A paste for one of a via and an external feature, such as a pad, tab, or line, of a ceramic substrate, includes at least one of titania and zirconia, and a filler material mixed with the at least one of titania and zirconia. Further, the via structure or external feature such as an input/output pad, tab, or line, includes a metallic plating thereover. A method of forming the via structure or the external feature on the ceramic substrate, includes steps of either depositing the paste in the via of the ceramic substrate or depositing the paste on the ceramic substrate, and depositing, by a dry process metallic plating, a metallic plating on the paste. The paste includes at least one of titania and zirconia for reducing residual stress without effecting the platability of the metallic plating.
申请公布号 US6068912(A) 申请公布日期 2000.05.30
申请号 US19980071409 申请日期 1998.05.01
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 REDDY, SRINIVASA S. N.;WALL, DONALD R.
分类号 H05K1/09;C04B41/52;C04B41/89;C12N15/34;C23C16/06;H01L23/498;H05K1/03;H05K1/11;H05K3/24;H05K3/40;(IPC1-7):B32B3/00;C04B35/46 主分类号 H05K1/09
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