| 摘要 |
PROBLEM TO BE SOLVED: To make a large-diameter wafer supporting section of a fabricated wafer board exchangeable, by arranging a plurality of bars along the halves or less than halves of the outer peripheries of semiconductor wafers, connecting one end sections of the bars to each other by means of a connecting member, and, at the same time, detachably attaching many wafer supporting members to the bars. SOLUTION: Two parallel bars 1 having circular cross sections are arranged along the outer peripheries of loaded semiconductor wafers so that the bars 1 may be separated from the outer peripheries by about 1/12 peripheries of the wafers and one end sections of the bars 1 are connected to each other by fixing the end sections of the bars 1 to the peripheral edge section of a discoid connecting member 2 having an appropriate larger diameter than the wafers have. Then fork inserting ports 3 for taking in/out the fork of a wafer transfer device are formed to the bars 1 by cutting off parts of annular plates having inside diameters appropriately smaller than the outside diameters of the wafers, and outside diameters appropriately larger than the outside diameters of the wafers and supporting sections 4 are extended to the outer peripheries of the ring plates facing the ports 3. Then two through holes 5 are made through the supporting sections 4a and many wafer supporting members 7 are attached to the bars 1 by utilizing the holes 5.
|
