发明名称 ELECTRONIC COMPONENT MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting device that automatically cuts an empty tape being discharged from the electronic component mounting device to a specific dimension without depending on a worker, and can timely collect the waste tape. SOLUTION: When an electronic component (b) is mounted on a substrate (c), a supply part (m) of a taped member 2 consisting of a carrier tape (t) where a number of the electronic components (b) are accommodated and a cover tape are allowed to face a fitting part (n) of the electronic component (b), a reception body 4 for receiving a carrier tape (t1) that became empty for the taped member 2 is provided between the supply and fitting parts (m) and (n), and a cutting means 5 for cutting the empty tape (t1) being fed to the reception body 4 is provided at the lower side of the reception body 4.
申请公布号 JP2000151186(A) 申请公布日期 2000.05.30
申请号 JP19980322723 申请日期 1998.11.13
申请人 TENRYUU TECHNICS:KK 发明人 ITO HIROSHI
分类号 B65D85/86;H05K13/02 主分类号 B65D85/86
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