| 摘要 |
<p>PROBLEM TO BE SOLVED: To facilitate a design and a manufacture and to reduce manufacturing costs by eliminating constraints to narrow a gap between plural leads. SOLUTION: An electrode pad 3 formed on a semiconductor chip 2, a lead group 4 made of plural element leads, and connection wires 15, 16 for connecting the lead group 4 to the electrode pad 3 are sealed with resin-formed body 19. The lead group 4 has a first lead group 5 and a second lead group 6. The first lead group 5 is electrically connected to the second lead group 6 and is two-dimensionally arranged. The lead group 4 having the first lead group 5 and the second lead group 6 is three-dimensionally arranged. Each of the lead elements 9, 11 of the second lead group 6 has a contact surface capable of contacting a solder ball 22, and the lead group 4 is three-dimensionally diffused and separated. This can dramatically improve the degree of freedom in arrangement to bond the lead to the solder ball 22.</p> |
