| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer circuit board with a metal base having excellent heat radiation, anti noise property, breakdown voltage and productivity. SOLUTION: In this multilayer circuit board with a metal base, a surface of a metal plate 1 on which a conductor circuit layer 3 is not placed has convex warpage and the maximum amount of warpage is 1 to 20μm per 1 cm in the maximum warpage direction. Preferably, the total number of via holes 6 and through holes is 1 to 100,000 per 1 m2. Further, in one or more lands, the area of the conductor part section of via holes 6 or through holes constituting a land is 4.0×10-3 mm2 or larger per 1 mm2 of the land area.</p> |
