发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURE OF IT
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device comprising a trench capacitor with no void occurrence, drop of capacitance, or degradation in reliability of an insulating film. SOLUTION: A semiconductor substrate 30 comprising a trench groove 31, a capacitor insulating film 32 formed on the inside surface of the trench groove, and a capacitor electrode of a conductive material comprising such impurities as embedded in the trench groove where a capacitor insulating film is formed on the inside surface are provided. The conductive material constituting the capacitor electrode has such concentration gradient as the impurity concentration is lower at a trench lower part than at a trench upper part.
申请公布号 JP2000150830(A) 申请公布日期 2000.05.30
申请号 JP19980328062 申请日期 1998.11.18
申请人 TOSHIBA CORP 发明人 AKAHORI HIROSHI;KATSUI SHUJI;TERAI FUJIO;SHIOZAWA JUNICHI;MIKATA YUICHI
分类号 H01L27/04;H01L21/822;H01L21/8242;H01L27/108 主分类号 H01L27/04
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