| 摘要 |
<p>PROBLEM TO BE SOLVED: To realize wiring in the shortest distance against a mounting substrate, and electric connection from an arbitrary position on the surface of an IC chip and to reduce parasitic capacity for mounting the IC chip for high frequency/high speed circuit. SOLUTION: At the time of fixing an array sensor 1 where plural unit sensor chips 4 are arranged in a matrix form to wiring bodies, the plural unit wiring bodies 6 are arranged in the matrix form and the unit wiring bodies 6 and the unit sensor chips 4 are electrically connected by a conductor like a probe so as to fix them. The conductor is arranged between the forming plane of the array sensor 1 and the forming plane of a distribution part 2 being the set of the unit wiring bodies. The conductor is formed of a part which is in one plane and is fixed to the unit wiring bodies 6 and a rising part or is arranged to pass through the wiring bodies. It is installed in the shortest distance. The array sensor and the distribution part 2 are fixed in a high temperature room through cream solder at the tip of the conductor. Since wiring is executed in the shortest distance, parasitic capacity is small.</p> |
