| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is constituted in such a way that the bonding strength between a lead frame and a chip can be measured in a state of being nearly equal to the state of a wire-bonded line and, at the same tme, the bonding strength of the wire bonding to the chip can be predicted or measured. SOLUTION: A measuring instrument measures the bonding state of a semiconductor device 4 composed of a lead frame 1 and a chip 3 fixed to the frame 1 with an adhesive 2. The instrument is constituted of a fixing means 5 on which the semiconductor device 4 is placed and which fixes the lead frame 1, a heating means 6 which is assembled with the fixing means 5 for heating the semiconductor device 4 and for maintaining the fixing means 5 at a prescribed temperature, a first measuring means 7 which applies a shear force to the end face of the chip 3 on the lead frame 1 and measures the load, and a second measuring means 8 which measures the displaced amount of the chip 3 which is displaced on the lead frame 1 when the shear force is applied to the end face of the chip 3.
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