PROBE NEEDLE FOR WAFER TEST AND ITS PRODUCTION METHOD AND SEMICONDUCTOR DEVICE TESTED WITH THE PROBE NEEDLE

摘要

PROBLEM TO BE SOLVED: To provide a probe needle which surely obtains electrical contact by a small needle slide by making the true contact area of between the probe needle tip end and an electrode pad and having high productivity, a production method and a semiconductor device tested with the probe needle. SOLUTION: The tip end and an electrode pad 2 are electrically contacted, by pressing the tip end of a semiconductor integrated circuit to the electric pad for testing the function of the semiconductor integrated circuit using a probe needle 1 for wafer test. The probe needle 1 is constituted of a side part and a tip end part. The tip end part is a spherical curve, of which a radius of curvature (r) for an electrode pad thickness (t) is made such that 9t<=r<=35t.