发明名称 JOINING STRUCTURE OF FLOOR AND WALL AND BUILDING
摘要 PROBLEM TO BE SOLVED: To provide the joining structure of an inexpensive floor and wall which is easy in manufacturing and excellent in performance by stretching a floor plate material and a reverse plate material upward and downward of a floor frame, and erecting the wall on a floor panel integrated by filling a part therebetween with a foam heat insulation material. SOLUTION: A floor plate material 52 comprising a particle board and a reverse floor plate 53 comprising the particle board are stretched upward and downward of a floor frame 51. A foam urethane resin is foamed and filled without any gap into the inside of the floor frame 51 to be adhered. Next, after a screw nail is driven into a floor plate material 52 and a floor joist from the lower frame material of a wall 4 to be fixed, an inner wall material is nailed and fixed to erect and join a floor panel 5 and a wall 4. Thereby since the floor frame 51, the floor plate material 52, the reverse plate material 53 and a foam heat insulation material 54 are integrated, the strength of the floor panel 5 is large, the load of the upward erected and joined wall 4, fallen snow load on the floor panel 5 and the loading load of a room can be received by the whole floor panel 5, and they can be born sufficiently.
申请公布号 JP2000144997(A) 申请公布日期 2000.05.26
申请号 JP19980328184 申请日期 1998.11.18
申请人 SEKISUI CHEM CO LTD 发明人 KANEKO NORIYUKI
分类号 E04B2/56;E04B1/00;E04B5/02;E04B5/43;(IPC1-7):E04B5/43 主分类号 E04B2/56
代理机构 代理人
主权项
地址