发明名称 PRODUCTION OF ELECTRODE WIRING CONDUCTION HOLE AND PRODUCTION OF SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a process for producing electrode wiring conduction holes capable of forming the small electrode wiring conduction holes in a semiconductor element and a process for producing a semiconductor device. SOLUTION: The hole patterns for the electrode wiring conduction holes are transferred to a thin film of the photosensitive material on a wafer by projecting the first light transmitted through translucent regions consisting of a translucent film 4 and the second light which is transmitted through the apertures consisting of the translucent parts 3 disposed in the translucent regions and is the antiphase from the phase of the first light through a lens.</p>
申请公布号 JP2000147746(A) 申请公布日期 2000.05.26
申请号 JP20000007857 申请日期 2000.01.17
申请人 HITACHI LTD 发明人 HASEGAWA NORIO;TANAKA TOSHIHIKO
分类号 H01L21/027;G03F1/32;G03F1/68;(IPC1-7):G03F1/08 主分类号 H01L21/027
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