FORMING METHOD OF FEATURE ON SUBSTRATE, PREPARATION METHOD OF TRENCH AND VIA, AND PREPARATION METHOD OF MAGNETICALLY ALIGNED WIRES AND MUTUAL CONNECTORS

摘要

PURPOSE: A defining method of a feature on a substrate is provided to reduce a contacting region due to the formation of an open circuit or the misalignment of vias and trenches because the vias and the trenches are aligned magnetically. CONSTITUTION: To define a feature on a substrate, a lower photoresist layer is formed on the substrate. An upper photoresist layer is formed on the lower photoresist layer. Then, the upper photoresist layer is exposed by transmitting a first mask for developing the upper resist layer to form an aperture on the upper photoresist layer. And, the lower photoresist layer is exposed by transmitting the aperture formed on a second mask and the upper photoresist layer to expose a portion of the lower photoresist layer corresponding to the portion of the aperture. Herein, the aperture is formed on the upper photoresist crosses to the aperture in the second mask. Then, the lower photoresist layer is developed to form an aperture on the lower photoresist layer. And, a feature is formed by using the aperture of the lower photoresist layer.