| 摘要 |
PURPOSE: A package mounting a semiconductor is provided to increase a productivity of the semiconductor by improving a cost efficiency and improving a characteristic of heat emitting of a high heat emitting package using a diamond. CONSTITUTION: A package mounting a semiconductor is composed of a diamond coating substrate(2) coated with diamond partially or entire surface, and a high heat conductive metal member(3) bonded on an opposite face to the face loaded the semiconductor device(8) of the diamond coated substrate(2). The diamond coating substrate(2) contains at least one kind among Si, AlN, SiC, CuW. When the diamond substrate(1) is used, a thickness of diamond is over 100 under 500 micrometers, and when the diamond coating substrate(2) is used, a thickness of diamond needs to be over 10 under 200micrometers. |
