发明名称 |
METHOD OF PRODUCING SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE: A method for producing a semiconductor device is provided to reduce the number of preparation processes without need of transfer gate sacrificial oxide and to reduce divot, degradation and defects of an isolation part. CONSTITUTION: A producing method comprising: forming an oxide layer(2) on a semiconductor device substrate(1); forming a silicon nitride layer(3) on the oxide layer; forming an isolation area(4) in the substrate; removing the silicon nitride layer; injecting dopant ions into the substrate by using the oxide layer as a screen; forming a gate oxide layer(9) on the substrate after removing the oxide layer; filling in the isolation area with TEOS(Tetraethylorthosilicate), other oxides or insulators; and polishing the TEOS, other oxides or the insulators.
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申请公布号 |
KR20000028655(A) |
申请公布日期 |
2000.05.25 |
申请号 |
KR19990038816 |
申请日期 |
1999.09.11 |
申请人 |
INTERNATIONAL BUSINESS MACHINED CORPORATION |
发明人 |
HOLYHAN KEVIN M.;LAN KINJED H. |
分类号 |
H01L21/335;H01L21/28;H01L21/314;H01L21/316;H01L21/762;H01L21/8238;(IPC1-7):H01L21/335 |
主分类号 |
H01L21/335 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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