| 摘要 |
<p>An apparatus (20) for processing a substrate (32) in a processing system having multiple process chambers (22) and a common transfer chamber (26) comprises a process chamber (22) having a process space (23) to receive and process a substrate (32) and a buffer chamber (24) defining a buffer space. The buffer chamber (24) is positioned beneath the process chamber (22) and is configured for interfacing with a transfer chamber (26) of a processing system for receiving a substrate (32) to be processed. A passage (43) is formed between the process and buffer chambers for moving a substrate between the process space and buffer space and a movable substrate stage (30) in the buffer space is operable for moving vertically in said passage (43) between a first position wherein the substrate is positioned in the buffer space and a second position wherein the substrate is positioned within the process space of the process chamber (22). A sealing mechanism (42) is operable for sealing said passage to isolate the process chamber and a pumping system (52) is coupled to the buffer chamber for purging the buffer space of contaminants which may leak from the process chamber (22) to generally reduce the escape of the contaminants through the buffer chamber (24) and into the common transfer chamber (26) and other process chambers of a multiple chamber system.</p> |
