发明名称 |
Production of e.g. multilayer metal plastic laminate forming lead frame, includes stamping processes raising contact surfaces and adhesive dams, advancing miniaturization by replacement of ball grid arrays |
摘要 |
A metal foil (1) is formed by stamping and/or deep drawing of at least one metal contact surface (3, 4). The metal foil is laminated with plastic film (2), holding the contact surface profile closely. In a similar alternative, the plastic film is first laminated to the metal foil before stamping. More films and foils may be included. An Independent claim is also included for the metal/plastic laminate and corresponding lead- or support frame made as described. Preferred features: The metal contact surface is re-stamped. Following lamination, the metal contact surface has a profile height (h) of 20-50 microns . There is at least one depression (7) in the foil, to make contact with components. There is a further depression (5) at the edge of the contact surface and/or at least one more (6) in the region where lamination will later take place. |
申请公布号 |
DE19852832(A1) |
申请公布日期 |
2000.05.25 |
申请号 |
DE1998152832 |
申请日期 |
1998.11.17 |
申请人 |
W. C. HERAEUS GMBH & CO. KG |
发明人 |
BAUER, ALFRED;HARTMANN, HORST;KOLODZEI, GUENTER |
分类号 |
B29C65/64;H01L21/48;H05K3/20;H05K3/40;(IPC1-7):B29C65/64 |
主分类号 |
B29C65/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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