A SEMICONDUCTOR CHIP AND A LEAD FRAME

摘要

A semiconductor chip (1) includes a semiconductor substrate having an electronic circuit (2) thereon and a number of bond pads (3, 4, 5) thereon. The bond pads (3, 4, 5) are coupled to the electronic circuit (2) and permit power to be supplied to the electronic circuit (2) and signals to be input to and output from the electronic circuit (2). The bond pads (3, 4, 5) are arranged on the surface of the substrate such that at least some of the pads (3b, 4b) are separated from the edge of the substrate by other bond pads (3a, 4a, 5). A lead frame (10) is also provided in which two of the contact pins (13, 14) are electrically coupled to each other by a contact strip (19) which extends along at least a portion of an edge (22) of a die pad (11). The contact strip (19) is located between the die pad (11) and some of the other contact pins (12).