发明名称 METAL BOND GRINDSTONE AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To provide a metal bond grindstone capable of extending using longevity of it by preventing wasteful falling out of diamond abrasive grains and its manufacturing method. SOLUTION: It is a metal bond grindstone furnished with a metal bond abrasive grain layer 1 made by dispersing diamond abrasive grains 4 forming a metal covering 5 on its surface in a sintered metallic bond phase 2, the metal covering 5 contains one or more than two kinds of metal components for melting point adjustment to be selected from silver, copper, aluminium, tin, zinc, cobalt and nickel and one or more than two kinds of metal components for carbide formation to be selected from titanium, chrome, iron, molybdenum, vanadium, tungsten and silicon, and a carbide 6 of the metal component for carbide formation exists on an interface of the metal covering 5 and the diamond abrasive grains 4.
申请公布号 JP2000141230(A) 申请公布日期 2000.05.23
申请号 JP19980324264 申请日期 1998.11.13
申请人 MITSUBISHI MATERIALS CORP 发明人 IKEDA YOSHITAKA;HOSHI JUNJI
分类号 B24D3/00;B24D3/06;(IPC1-7):B24D3/00 主分类号 B24D3/00
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