发明名称 HIGH-FREQUENCY TREATING INSTRUMENT
摘要 PROBLEM TO BE SOLVED: To provide a high-frequency treating instrument capable of surely solidifying and cutting an organ by surely gripping the organ. SOLUTION: In a high-frequency treating instrument provided with an inserting portion, a pair of gripping portions 6 and 7 arranged in the tip part of the inserting portion for solidifying or cutting a living body organ by gripping the same, and an operation portion connected to the base end part of the inserting portion for opening/closing the gripping portions, and adapted to solidify/cut the living body organ gripped by the gripping surfaces of the gripping portions by carrying high-frequency currents to the gripping portions, one gripping portion 7 is provided as a first electrode portion, where a high-frequency current is supplied between the electrode portions of the other gripping portion 6, and the other gripping portion 6 is provided with a second electrode portion 22, to which a high-frequency current for solidification is supplied, a third electrode portion 20, to which a high-frequency current for cutting is carried, and an insulating portion 21 for electrically insulating the second and third electrodes and forming the gripping surface with the second and third electrode portions.
申请公布号 JP2000139943(A) 申请公布日期 2000.05.23
申请号 JP19990012914 申请日期 1999.01.21
申请人 OLYMPUS OPTICAL CO LTD 发明人 SEKINO NAOKI;YAMAUCHI KOJI
分类号 A61B18/12 主分类号 A61B18/12
代理机构 代理人
主权项
地址