| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a ceramic structure having a high joint strength and good joint characteristics substantially without causing irregularity by joining a plurality of ceramic members to each other through a joining material having a specific thermal expansion coefficient ratio to those of the ceramic members. SOLUTION: This ceramic structure is obtained by baking a joining material having a thermal expansion coefficient of 90-97% based on those of a plurality of ceramic members on the joining surfaces of the ceramic members, polishing the surfaces in a flatness degree of <=50μm and a joining material thickness of 20-50μm, pressing the faced surfaces of the members onto each other and subsequently thermally treating the pressed members at 700-1,000 deg.C to join each other. The thermal expansion coefficient of the joining material is obtained by using at least two of SiO2, Al2O3, B2O3, Bi2O3, BaO and ZnO. For example, a ceramic plate 1 for producing semiconductors can be obtained as a hollow lightweight ceramic structure 4 by separately producing a ceramic ceiling plate 2 and a box 3 and subsequently joining the members.</p> |
