System for connecting subsystems of dissimilar thermal properties

摘要

A system which includes a chassis having a first side and a second side; a circuit board having a set of components, the first circuit board mounted on the first side of the chassis; an integrated circuit package mounted on the second side of the chassis; and a set of electrical connections providing a communications network between the circuit board and the integrated circuit package; wherein the integrated circuit package is thermally coupled to the second side of the chassis.