| 摘要 |
<p>Plating method and apparatus capable of making a plating liquid enter fine grooves and holes formed in a base to be plated, without adding a surfactant to the plating liquid; and carrying out a plating operation which enables the formation of a high-quality plated layer free from the occurrence of missing portions and defective portions, the plating method being adapted to subject the base to be plated to electrolytic or electroless plating, and comprising subjecting the object base to plating after a dissolved gas in the plating liquid is deaerated or while a dissolved gas in the plating liquid is being deaerated; and/or subjecting the object base to a pretreatment after the dissolved gas in a pretreatment liquid is deaerated or while a dissolved gas in the pretreatment liquid is being deaerated, and thereafter subjecting the resultant base to plating.</p> |
