发明名称 |
METHOD AND DEVICE FOR BONDING A WIRE CONDUCTOR |
摘要 |
<p>Process and device for the contacting of a wire conductor (113) in the course of the manufacture of a transponder unit arranged on a substrate (111) and comprising a wire coil (112) and a chip unit (115), wherein in a first phase the wire conductor (113) is guided away via the terminal area (118, 119) or a region accepting the terminal area and is fixed on the substrate (111) relative to the terminal area (118, 119) or the region assigned to the terminal area, and in a second phase the connection of the wire conductor (113) to the terminal area (118,119) is effected by means of a connecting instrument (125).</p> |
申请公布号 |
EP0880754(B1) |
申请公布日期 |
2000.05.17 |
申请号 |
EP19970914139 |
申请日期 |
1997.02.12 |
申请人 |
FINN, DAVID;RIETZLER, MANFRED |
发明人 |
FINN, DAVID;RIETZLER, MANFRED |
分类号 |
G06K19/077;H01L21/607;H05K3/10;(IPC1-7):G06K19/077 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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