发明名称 PACKAGE FOR OPTICAL SEMICONDUCTOR ELEMENT HOUSING
摘要 <p>PROBLEM TO BE SOLVED: To make light excited by an optical semiconductor element efficiently deliver to an optical fiber member and to enhance the transmission efficiency of a light signal. SOLUTION: This package consists of a base body 1, having a mounting part 1a mounted with an optical semiconductor element 4 on the upper surface thereof, a frame body 2, which is attached on the base body 1, in such a way as to encircle the optical semiconductor element mounting part 1a and has a through-hole 2a in the side part thereof, a frame-shape fixed member 9, which has a main surface attached to the periphery of the through-hole 2a formed in the frame body 2 on one side of the main surfaces thereof and is bonded to an optical fiber member 11 on the side of the other main surface thereof, a light-transmitting member 10, which is attached to the frame-shaped fixed member 9 and blocks the interior of the member 9, and a cover member 3, which is attached to the upper surface of the frame body 2 and hermetically seals the element 4. In this case, the member 9 is formed in such a way that the external size on the side of the main surface on one side of the main surfaces thereof is smaller than that on the side of the other main surface thereof, and the member 10 is attached to the region on the side of the main surface, which has smaller exterior dimensions on one side of the main surfaces of the member 9.</p>
申请公布号 JP2000138323(A) 申请公布日期 2000.05.16
申请号 JP19980308289 申请日期 1998.10.29
申请人 KYOCERA CORP 发明人 YANAGISAWA MITSUO;MASUDA HISAKI
分类号 H01L23/29;H01L21/56;H01L23/02;H01L23/31;(IPC1-7):H01L23/29 主分类号 H01L23/29
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