发明名称 WAFER POLISHING SURFACE PLATE, MANUFACTURE THEREFOR AND WAFER POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To shorten flatness working time of the surface of a surface plate in surface plate manufacturing by forming a surface layer composed of a highly workable object material on the surface of a highly rigid disk-like member, and flatly working the surface of the surface layer. SOLUTION: A highly rigid disk-like member 21a is installed on a surface plate receiver 22. The upper surface of the highly rigid disk-like member 21a is not required to be flat, and may be the rugged surface. Next, a surface layer 21b composed of a highly workable object material is formed on the upper surface of the highly rigid disk-like member 21a by coating, etc. Since the surface of this surface layer 21b normally becomes the recess/projection surface, the surface of this surface layer 21a is flatly worked. A surface plate 21 is manufactured in this way. General purpose machine work such as cutting, grinding and lapping can be adopted as a method for flatly working the surface of this surface layer 21b, but when considering workability and a work environment, grinding work is desirable.
申请公布号 JP2000135671(A) 申请公布日期 2000.05.16
申请号 JP19980310629 申请日期 1998.10.30
申请人 SHIN ETSU HANDOTAI CO LTD 发明人 TANAKA KOICHI
分类号 B24B37/12;B24B37/14 主分类号 B24B37/12
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