发明名称 |
Surface treatment for bonding pad |
摘要 |
A surface treatment method for bonding pad is described, in which a passivation layer is formed on a bonding pad and an opening is formed within the passivation by a plasma etching process. The bonding pad is corroded by the etching plasma containing fluorine during the etching process. The bonding pad is rinsed with deionized water comprising carbon dioxide to reduce the effects of the corrosion phenomenon.
|
申请公布号 |
US6063207(A) |
申请公布日期 |
2000.05.16 |
申请号 |
US19990241525 |
申请日期 |
1999.02.01 |
申请人 |
UNITED SEMICONDUCTOR CORP. |
发明人 |
YU, CHIA-CHIEH;CHOU, TA-CHENG |
分类号 |
H01L21/60;(IPC1-7):H01L21/00;C23F1/00 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|