发明名称 METHOD FOR FORMING METAL WIRE OF SEMICONDUCTOR DEVICES
摘要 PURPOSE: A metal wire formation method using damascene process is provided to prevent a loss of upper portion of tungsten plug by forming a tungsten nitride layer on the tungsten plug. CONSTITUTION: By selective etching an oxide layer(3), a contact hole is formed to expose portions of a conductive layer(2) and a poly-wire(4). After depositing a barrier layer(5), a tungsten plug(6) is filled into the contact hole. By forming a tungsten nitride layer(7) on the tungsten plug(6) using annealing process at N2 gas atmosphere, the tungsten nitride layer(7) used as an etching stopper and barrier. Thereby, the upper of the tungsten plug(6) is protected from etching for forming a metal wire(10).
申请公布号 KR20000027707(A) 申请公布日期 2000.05.15
申请号 KR19980045705 申请日期 1998.10.29
申请人 ANAM SEMICONDUCTOR., LTD. 发明人 CHO, KYUNG SU
分类号 H01L21/768;(IPC1-7):H01L21/768 主分类号 H01L21/768
代理机构 代理人
主权项
地址