| 摘要 |
PURPOSE: A stacked package is provided to shorten signal transfer paths by connecting a lead frame to a pad through a pattern film, thereby preventing delay in signal transfer. CONSTITUTION: A stacked package comprises upper and lower semiconductor chips(10,11), a lead frame, sealing material(60) and solder balls(70). The lead frame is bonded on a rear surface of the chips(10,11). A pattern film(52) longer than a conductive base(51) is bonded on an inner surface of the base(51). Metal films are attached on both sides of an insulation film. Via holes are formed on the pattern film(52) for connecting the metal films. The inner wall of the metal films is coated with conductive metal. The pattern film(52) is bonded on pads of the chips(10,11). The portion between both bases(51) is molded with the sealing material(60). The solder balls(70) are attached to the bottom of the base(51).
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