| 摘要 |
<p>PURPOSE: A chip scale semiconductor package is provided to increase the mounting density when manufacturing the semiconductor module using tab film mask. CONSTITUTION: A chip scale semiconductor comprises a semiconductor chip, a bonding pad(10), a tab film mask(2), an inner hole(20), an outer hole(21), a signal line(22), an inner solder, an outer solder, a printing circuit substrate, a packaging material, and a solder paste. A plurality of bonding pads are formed on the semiconductor chip. A plurality of inner holes are adhered at the bonding pad of the semiconductor chip and the outer holes are located within a distance from the inner holes. The outer holes are included in the tap film mask. The signal line is to electrically connect the inner solder and the outer solder.</p> |
