发明名称 SLURRY PROVIDING DEVICE OF SEMICONDUCTOR CHEMICAL MECHANICAL POLISHING APPARATUS
摘要 PURPOSE: A device for providing a slurry is provided to prevent the slurry element from being conglomerate by using the ultrasonic and to prevent the surface of the wafer from being scratched by decomposing the conglomerated slurry element. CONSTITUTION: A device comprises a slurry(1), a mixed slurry(2), a slurry for supply(3), a drum(10, 110), a slurry absorbing tube(11, 111), a upper reflection plate(12), a lower reflection plate(13), an ultrasonic generator(14), a middle pump(20), a filter(30, 80), a mixture tank(40), a slurry supply tube(41), a DI supply tube(42), a circulation tube for a mixed slurry(43), a valve(44, 61, 64, 66), an absorbing tube for a mixed slurry (45), a mixture pump(50), a supply tank(60), a supply tube for a mixed slurry(62), a circulation tube for slurry supply(63), a supply pump(70), and a supply tube(81). A certain amount of slurry is kept in the drum(10, 110). The ultrasonic generator(14) is installed at the drum to prevent the conglomeration of the slurry element.
申请公布号 KR20000026458(A) 申请公布日期 2000.05.15
申请号 KR19980043988 申请日期 1998.10.20
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KO, SE JONG;RYU, JUN GYU;YOUN, YOUNG HWAN;KWAG, GYU HWAN
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
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