| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component package, which can obtain wirings of a high density at low cost and moreover, can be easily manufactured and furthermore, can use a core substrate of a work size, which is as large as possible, and the manufacturing method of the package of an electronic component. SOLUTION: A base material layer 1704, which is provided with copper foil pads 1706 on one side thereof and has first via holes 1707, and an insulating layer 1703 having second via holes 1708 provided in the other one side of the layer 1704 and a semiconductor chip 1701 having electrodes 1702 in the state corresponding to the positions of the via holes 1708 are vertically laminated, the sectional area of the via holes 1708 is formed narrower than that of the via holes 1707 and the first and second via holes are filled with a conductive material 1705. |
