| 摘要 |
PROBLEM TO BE SOLVED: To prevent organic matters from sticking on the end surface of a semiconductor laser device due to photochemical reactions, by introducing oxygen into the chamber of an apparatus for airtight sealing the semiconductor laser device, and by projecting ultraviolet rays on the package with the mounted semiconductor laser device thereon and present in the chamber, and furthermore by airtightly sealing the chamber in an inert gas atmosphere. SOLUTION: An unsealed module 10a is carried via a pre-chamber 21a into a chamber 21 of an apparatus for sealing the module 10a airtightly. Thereafter, while being introduced into the chamber 21 nitrogen and oxygen respectively from an inert gas inlet pipe 22 and an oxygen inlet pipe 23 via flow-rate adjusting means 22a, 23a, ultraviolet rays from lamps 24 are projected on the module 10a to decompose and remove organic matters thereon. Thereafter, the gases in the chamber 21 are exhausted to the outside air via an ozone-decomposing apparatus 41 to subsequently purge the inside of the chamber 21 with such inert gas as nitrogen and helium. Then, the package of the module 10a is covered with a cap 13 to seal the peripheral edge portion of the cap 13 into an airtight state through welding with a resistance welder 30 installed in the chamber 21.
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