| 摘要 |
PROBLEM TO BE SOLVED: To restrain generation of depressions on the upper part of a wiring layer above plugs. SOLUTION: This method contains the processes (a)-(e), in which (a) a process for forming an impurity diffused layer 34, (b) a process for forming an interlayer insulating layer 40 having through-holes 42, on the impurity diffused layer 34, (c) a process for forming plugs 50 in the through-holes 42, (d) a process for forming a substratum layer 62 on the plugs 50 and the interlayer insulating layer 40, and (e) a process for forming an aluminum layer 64 on the substratum layer 62. The aluminum layer 64 is formed under the conditions that temperature of a substrate is at least 250 deg.C and pressure is reduced.
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