| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting electronic parts on a board making use of anisotropic conductive adhesive, with only the self weight of the electronic parts and without especially applying pressure to the electronic parts. SOLUTION: Anisotropic conductive adhesive 1 is applied to electrodes 5 on a board 4. Then, parts 3 to be mounted such as a QFP package, resistor, capacitor are positioned and provisionally fixed at prescribed positions. After that, the board on which the parts are provisionally fixed is put into a bag 10 of silicon rubber provided beforehand with an exhaust system which can perform evacuate. The bag 10 is evacuated down to 0.05 atm pressure by using a rotary pump. The bag is left in a heating furnace in this state for 60 seconds for curing the anisotropic conductive adhesive 1. Then the inside of the bag of silicon rubber is restored to atmospheric pressure, and the board 4 on which placing of the parts is completed is taken out. |
