| 摘要 |
PROBLEM TO BE SOLVED: To provide a light-weight package which allows a semiconductor element housed inside to operate at an appropriate temperature, correctly and stably. SOLUTION: A frame-like base body 1, a heat radiator 2, which when inserted in a hole part of the base body 1, comprises a placement part 2a where a semiconductor element 5 is placed on the upper surface, a frame-like wall member 3 which is fitted on the upper surface of the base body 1, while surrounding the placement part 2a, and a lid body 4 which is jointed to the upper surface of the wall member 3 for closing the inside of the all member 3 are provided. Here, the heat radiator 2 comprises a unidirectional composite material, where a carbon fiber arrayed in thickness direction is coupled with carbon, while an exposed outside surface is coated with a coating layer 10. |
