| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method with which a wiring board having resistor on which wiring layers are formed at a high density and a resistive body having a prescribed electrical resistance value is integrally formed with the wiring layers, in a state in which the resistor is connected to the wiring layers and which can efficiently absorb the heat generated, when a mounted semiconductor element, capacitance element, etc., operate. SOLUTION: A wiring board with resistor is manufactured, in such a way that an oxide film 4 is formed on the surface of a substrate 1 composed of a sintered aluminum nitride material and a thin-film wiring layer 2 and a thin- film resistor 3 are formed by a thin-film forming technology. After the resistor 3 is formed, the resistor 3 is trimmed by projecting a laser beam upon the resistor 3 so that the electric resistance value of the resistor 3 becomes a prescribed value.</p> |
