| 发明名称 |
Heat sink for electric and/or electronic devices |
| 摘要 |
<p>A heat sink adapted for use with an electrical and/or electronic device, in particular with a semiconductor chip such as an integrated circuits, or with a casing for such a device, is formed from a material including whiskers.</p> |
| 申请公布号 |
EP0999590(A2) |
申请公布日期 |
2000.05.10 |
| 申请号 |
EP19990890331 |
申请日期 |
1999.10.21 |
| 申请人 |
ELECTROVAC, FABRIKATION ELEKTROTECHNISCHER SPEZIALARTIKEL GESELLSCHAFT M.B.H. |
发明人 |
HAMMEL, ERNST DR.;HOLZER, HERMANN DR. |
| 分类号 |
H01L23/36;F28D15/02;G12B15/06;H01L23/367;H01L23/373;(IPC1-7):H01L23/373 |
主分类号 |
H01L23/36 |
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