| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition capable of readily making a rough surface even by using a resin having difficulty in rough surface formation, exhibiting a sufficient conductor density strength by adding a specific inorganic or organic filler to a curable resin. SOLUTION: This resin composition comprises at least (A) a curable resin (e.g. epoxy resin, imide-based resin, etc.), and (B) an inorganic or organic filler (e.g. silica, talc, cross-linked acrylic resin, fluororesin, vinylidene fluoride resin, etc.), having 1-5μm particle diameter, capable of being eluted I in a solution. The component B has preferably 30-900 m2/g specific surface area and the amount of the component B added is preferably 5-50 pts.wt. based on the resin composition. The composition is preferably used as an electric insulation layer in an electronic instrument part provided with an electric insulation layer such as printed wiring board, multichip module, etc. Consequently an electronic instrument part, etc., can be provided in good productivity even by using an imide resin having difficulty in rough surface formation. |
